Main FPC Material |
Brand |
Taiflex, Graceth, SY |
PCB Material |
Brand |
SY, ITEQ, KB |
Texture |
Texture Brand |
PI, PET |
Coverlay Film |
Brand |
Taiflex, Graceth, SY |
Layers |
|
1-24 layers (sample), 1-12 layers (production) |
Finished Board Thickness |
mm |
0.25-6.0 mm (sample), Rigid-Flex PCB 0.25-6.0 mm |
Minimum Line/Space |
mm |
0.05 mm / 0.05 mm |
Maximum Finished Board Size |
mm |
230*450 mm |
Finished Board Thickness Tolerance |
mm |
±0.05 mm |
PP Thickness |
μm |
12.5 μm, 25 μm, 50 μm |
Copper Thickness |
μm |
12 μm, 18 μm, 36 μm, 70 μm |
Stiffener Material |
Type |
FR4 / PI / PET / SUS / PSA |
Surface Finish |
Type |
ENIG, Immersion Tin, OSP, Immersion Silver, Gold Plating |
Minimum Hole Size |
mm |
Mechanical: 0.15 mm, Laser: 0.1 mm |
Hole Tolerance |
mm |
NPTH: ±0.05 mm, PTH: ±0.075 mm |
Coverlay Color |
Type |
Yellow, Black |
PI Thickness |
mil |
0.5, 0.7, 0.8, 1, 2 mil |
Maximum FPCB Layers |
|
1-8 layers |
Minimum Finished Board Size |
mm |
5 mm * 8 mm |
Minimum Pad |
mm |
Inner Layer: 5 mil, Outer Layer: 4 mil |
Minimum Stiffener Size |
mm |
4 mm * 5 mm |
Maximum Stiffener Size |
mm |
32 mm * 32 mm |
Stiffener Alignment Accuracy |
mm |
±0.075 mm |
Minimum Open Area Size |
mm |
0.6 mm * 0.6 mm (stamped), 0.5 mm * 0.5 mm (precision stamping) |
Minimum Distance Between Open Areas |
mm |
0.5 mm (precision stamping), 0.2 mm (laser routing), 0.15 mm (normal drilling) |
Coverlay Overflow (one side) |
mm |
Normal: 0.08-0.12 mm, Limit: 0.03 mm |
Minimum Half-Hole Diameter on Gold Finger |
mm |
0.25 mm, Normal: 0.3 mm |
Rigid-Flex PCB: Peel Strength |
N |
1.4 N |
Rigid-Flex PCB: Flatness |
μm |
<15 μm before baking; <30 μm after baking |
Rigid-Flex PCB: Thermal Shock |
℃ |
288℃ (3 times for 10 seconds) |
Rigid-Flex PCB: Gold Wire Pull Strength |
g |
>6 g |
Rigid-Flex PCB: Minimum Board Thickness |
mm |
FPCB 0.1 mm, 4 layers 0.3 mm, 6 layers 0.5 mm, 8 layers 0.6 mm, 10 layers 0.8 mm |