Material |
Brand |
SY, ITEQ, KB, NOUYA |
HDI Construction |
|
1+N+1, 2+N+2, 3+N+3, 4+N+4, 5+N+5, 6+N+6, AnyLayer |
Construction Order |
|
N+N, N+X+N, 1+(N+X+N)+1 |
Layers |
|
1-40 layers |
Minimum Pattern Width / Spacing |
Unit: mil |
2/2 |
Minimum Mechanical Hole |
Unit: mm |
0.15 mm |
Minimum Board Core Thickness |
Unit: mil |
2 mil |
Laser Hole |
Unit: mm |
0.075 - 0.1 mm |
Minimum Prepreg Thickness |
Unit: mm |
2 mil |
Maximum Hole Diameter for Filling |
Unit: mm |
0.4 mm |
Via Fill Electroplating |
|
Available |
Electroplating Fill Size |
Unit: mil |
3-5 mil |
Pad for Via / Hole / VOP |
Unit: mil |
Available |
Distance from Hole Wall to Pattern |
Unit: mil |
7 mil |
Laser Drilling Accuracy |
Unit: mil |
0.025 mm |
Minimum Distance Between BGA Centers |
Unit: mil |
0.3 mm |
Minimum SMT Pitch |
Unit: mil |
0.25 mm |
Hole Fill Sinking |
Unit: mil |
≤10 μm |
Back Drilling / Countersink Tolerance |
Unit: mil |
±0.05 mm |
Through-Hole Plating Capability |
Ratio |
16:1 |
Blind Via Plating Capability |
Ratio |
1.2:1 |
Minimum BGA Pad |
Unit: mil |
0.2 |
Minimum Buried Hole (Mechanical) |
Unit: mil |
0.2 |
Minimum Buried Hole (Laser) |
Unit: mil |
0.1 |
Minimum Blind Hole (Laser) |
Unit: mil |
0.1 |
Minimum Blind Hole (Mechanical) |
Unit: mil |
0.2 |
Minimum Distance Between Laser Blind & Mechanical Buried Hole |
Unit: mil |
0.2 |
Minimum Laser Hole |
Unit: mil |
0.10 (Depth ≤ 55 μm), 0.13 (Depth ≤ 100 μm) |
Interlayer Alignment |
Unit: mil |
±0.05 mm (±0.002") |