HDI PCB Capabilities | High-Density PCB Manufacturing & Assembly – KKPCB - KKPCB
 

HDI PCB Manufacturing Capabilities

KKPCB provides advanced HDI (High-Density Interconnect) PCB manufacturing and assembly services, offering high precision, reliability, and support for complex multi-layer designs. Our processes ensure excellent signal integrity and performance for high-speed and high-frequency applications.
HDI PCB Technical Capabilities
Material Brand SY, ITEQ, KB, NOUYA
HDI Construction 1+N+1, 2+N+2, 3+N+3, 4+N+4, 5+N+5, 6+N+6, AnyLayer
Construction Order N+N, N+X+N, 1+(N+X+N)+1
Layers 1-40 layers
Minimum Pattern Width / Spacing Unit: mil 2/2
Minimum Mechanical Hole Unit: mm 0.15 mm
Minimum Board Core Thickness Unit: mil 2 mil
Laser Hole Unit: mm 0.075 - 0.1 mm
Minimum Prepreg Thickness Unit: mm 2 mil
Maximum Hole Diameter for Filling Unit: mm 0.4 mm
Via Fill Electroplating Available
Electroplating Fill Size Unit: mil 3-5 mil
Pad for Via / Hole / VOP Unit: mil Available
Distance from Hole Wall to Pattern Unit: mil 7 mil
Laser Drilling Accuracy Unit: mil 0.025 mm
Minimum Distance Between BGA Centers Unit: mil 0.3 mm
Minimum SMT Pitch Unit: mil 0.25 mm
Hole Fill Sinking Unit: mil ≤10 μm
Back Drilling / Countersink Tolerance Unit: mil ±0.05 mm
Through-Hole Plating Capability Ratio 16:1
Blind Via Plating Capability Ratio 1.2:1
Minimum BGA Pad Unit: mil 0.2
Minimum Buried Hole (Mechanical) Unit: mil 0.2
Minimum Buried Hole (Laser) Unit: mil 0.1
Minimum Blind Hole (Laser) Unit: mil 0.1
Minimum Blind Hole (Mechanical) Unit: mil 0.2
Minimum Distance Between Laser Blind & Mechanical Buried Hole Unit: mil 0.2
Minimum Laser Hole Unit: mil 0.10 (Depth ≤ 55 μm), 0.13 (Depth ≤ 100 μm)
Interlayer Alignment Unit: mil ±0.05 mm (±0.002")