Number of Layers |
1-80 layers |
Board Thickness |
0.2mm-8.0mm |
Board Material Type |
FR-4, High-Frequency, High-Speed, Metal-Core Material |
Board Thickness Tolerance |
Standard: ±0.1mm (≤1.0mm), ±10% (>1.0mm) |
Layers |
(Rogers, PTFE) + FR4 |
Outer Layer Copper Thickness |
0.33oz-14oz |
Material Brand |
ITEQ, Shengyi, TUC, Nan Ya, Panasonic, Isola, Nelco, Rogers, Taconic, Arlon, etc. |
Inner Layer Copper Thickness |
0.5oz-12oz |
Laser Drill Diameter |
0.075mm-0.15mm |
Minimum Hole Diameter |
0.1mm |
Backdrill Diameter |
0.2mm |
Backdrill Allowance |
0.05mm-0.25mm |
Minimum Resin-Filled Hole Diameter |
0.15mm |
Number of Laser Passes |
1-5 passes (consider ≥6 passes) |
Line Width / Spacing (Min) |
2/2 mil |
Impedance Accuracy |
Standard: ±10% (<50Ω), ±10% (≥50Ω) |
Aspect Ratio (Through Hole) |
25:1 |
Aspect Ratio (Laser Drill) |
1:1 |
Maximum Finished Board Size |
1500*620mm |
Minimum Finished Board Size |
2.0mm*2.0mm |
Minimum BGA Pitch |
0.35mm |
Outline Tolerance |
±0.1mm |
Solder Mask Color |
Green, Matte Green, Black, Matte Black, Yellow, Red, Blue, White |
Surface Finish |
Immersion Gold, Hard Gold, Gold Fingers, Lead-free HASL, HASL, OSP, Chemical Nickel / Immersion Gold,
Soft Gold (with/without Ni), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+Electrolytic Ferrite, Full Gold Plating+Electrolytic Ferrite, Silver Plating+Electrolytic Ferrite, Tin Plating+Electrolytic Ferrite
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