IC Substrate Capabilities | High-Density PCB & Assembly - KKPCB
 

IC Substrate Capabilities

KKPCB provides advanced IC substrate manufacturing and assembly services, delivering high-density, high-precision, and reliable solutions for semiconductor and electronic applications. Our processes ensure excellent signal integrity, thermal performance, and defect-free production.
IC Substrate Technics Capacity
Item Description DataSheet
Sheng Yi Core/P.P SI643HU, SI10U, SI09U, SI07U, SI05U
Mitsubishi Gas Chemical Core/P.P HL832NXA, HL832NS, HL832NSR(LC)
DooSan Core/P.P DS-7409HGB(S), DS-7409HGB(LE), DS-7409HGB(X)
Panasonic Core/P.P R1515E/R1515H
Other Materials Core/P.P E679FGB, E770G(LH), BT-NSF(LCA)
Layer Layer 1-16 Layers
Min Pattern Size um 25
Min Pattern Space um 25
Min Pad um 80
Min BGA Center Space um 250
2L Min Thickness um 80
2L Min Thickness / Core / PP Thickness um 80/30
4L Min Thickness / Core / PP Thickness um 200/50/20
6L Min Thickness / Core / PP Thickness um 240/50/20
8L Min Thickness / Core / PP Thickness um 330/50/20
Solder Mask Color Green, Black
Solder Resist EG23A, AUS308, AUS320, AUS410
Surface Treatment Soft Gold Plating, Hard Gold Plating, ENIG, OSP
Flatness um Max 5
Min Hole Size um 100
Min Laser Hole Size um 50
Min Thickness Tolerance um 30
Min PP um 25
Min Core um 40
Minimum Finger Center Distance um 65
Min Para-Position Accuracy um 15
Support Process Subtractive Process, mSAP Process
Soldermask Tolerance um 5