| IC Substrate Technics Capacity | ||
|---|---|---|
| Item | Description | DataSheet |
| Sheng Yi | Core/P.P | SI643HU, SI10U, SI09U, SI07U, SI05U |
| Mitsubishi Gas Chemical | Core/P.P | HL832NXA, HL832NS, HL832NSR(LC) |
| DooSan | Core/P.P | DS-7409HGB(S), DS-7409HGB(LE), DS-7409HGB(X) |
| Panasonic | Core/P.P | R1515E/R1515H |
| Other Materials | Core/P.P | E679FGB, E770G(LH), BT-NSF(LCA) |
| Layer | Layer | 1-16 Layers |
| Min Pattern Size | um | 25 |
| Min Pattern Space | um | 25 |
| Min Pad | um | 80 |
| Min BGA Center Space | um | 250 |
| 2L Min Thickness | um | 80 |
| 2L Min Thickness / Core / PP Thickness | um | 80/30 |
| 4L Min Thickness / Core / PP Thickness | um | 200/50/20 |
| 6L Min Thickness / Core / PP Thickness | um | 240/50/20 |
| 8L Min Thickness / Core / PP Thickness | um | 330/50/20 |
| Solder Mask Color | Green, Black | |
| Solder Resist | EG23A, AUS308, AUS320, AUS410 | |
| Surface Treatment | Soft Gold Plating, Hard Gold Plating, ENIG, OSP | |
| Flatness | um | Max 5 |
| Min Hole Size | um | 100 |
| Min Laser Hole Size | um | 50 |
| Min Thickness Tolerance | um | 30 |
| Min PP | um | 25 |
| Min Core | um | 40 |
| Minimum Finger Center Distance | um | 65 |
| Min Para-Position Accuracy | um | 15 |
| Support Process | Subtractive Process, mSAP Process | |
| Soldermask Tolerance | um | 5 |
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