| Material |
Brand |
SY, ITEQ, KB, NOUYA |
| HDI Construction |
|
1+N+1, 2+N+2, 3+N+3, 4+N+4, 5+N+5, 6+N+6, AnyLayer |
| Construction Order |
|
N+N, N+X+N, 1+(N+X+N)+1 |
| Layers |
|
1-40 layers |
| Minimum Pattern Width / Spacing |
Unit: mil |
2/2 |
| Minimum Mechanical Hole |
Unit: mm |
0.15 mm |
| Minimum Board Core Thickness |
Unit: mil |
2 mil |
| Laser Hole |
Unit: mm |
0.075 - 0.1 mm |
| Minimum Prepreg Thickness |
Unit: mm |
2 mil |
| Maximum Hole Diameter for Filling |
Unit: mm |
0.4 mm |
| Via Fill Electroplating |
|
Available |
| Electroplating Fill Size |
Unit: mil |
3-5 mil |
| Pad for Via / Hole / VOP |
Unit: mil |
Available |
| Distance from Hole Wall to Pattern |
Unit: mil |
7 mil |
| Laser Drilling Accuracy |
Unit: mil |
0.025 mm |
| Minimum Distance Between BGA Centers |
Unit: mil |
0.3 mm |
| Minimum SMT Pitch |
Unit: mil |
0.25 mm |
| Hole Fill Sinking |
Unit: mil |
≤10 μm |
| Back Drilling / Countersink Tolerance |
Unit: mil |
±0.05 mm |
| Through-Hole Plating Capability |
Ratio |
16:1 |
| Blind Via Plating Capability |
Ratio |
1.2:1 |
| Minimum BGA Pad |
Unit: mil |
0.2 |
| Minimum Buried Hole (Mechanical) |
Unit: mil |
0.2 |
| Minimum Buried Hole (Laser) |
Unit: mil |
0.1 |
| Minimum Blind Hole (Laser) |
Unit: mil |
0.1 |
| Minimum Blind Hole (Mechanical) |
Unit: mil |
0.2 |
| Minimum Distance Between Laser Blind & Mechanical Buried Hole |
Unit: mil |
0.2 |
| Minimum Laser Hole |
Unit: mil |
0.10 (Depth ≤ 55 μm), 0.13 (Depth ≤ 100 μm) |
| Interlayer Alignment |
Unit: mil |
±0.05 mm (±0.002") |