| SMT assembly capacity: 19 million points/day | ||
|---|---|---|
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| Throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP / common board / FPC / rigid-flex board / metal substrate | |
| DIP Daily Production Capacity | ||
|---|---|---|
| DIP Plug-in Production Line | 50,000 points/day | |
| DIP Post-Welding Production Line | 20,000 points/day | |
| DIP Test Production Line | 50,000 pcs PCBA/day | |
| PCB Assembly Processing Capability | ||
|---|---|---|
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioned workshops, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, and advanced complete equipment. Capable of performing various product assembly, packaging, testing, and aging. Monthly production capacity can reach 150,000 to 300,000 sets/month. |
| PCBA Processing Capability | ||
|---|---|---|
| Project | Mass Processing Capability | Small Batch Processing Capability |
| Number of Layers (Max) | 2-28 | 20-30 |
| Plate Type | FR-4, Ceramic Sheet, Aluminum Base, PTFE, Halogen Free, High Tg Sheet, Rogers, etc Teflon | PTFE, PPO, PPE, E-65, etc |
| Sheet Mixing | 4-6 layers | 6-8 layers |
| Biggest Size | 610mm x 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate Thickness Range | 0.2mm - 6.00mm | 0.2mm - 8.00mm |
| Thickness Tolerance (t≥0.8mm) | ±8% | ±5% |
| Thickness Tolerance (t<0.8mm) | ±10% | ±8% |
| Media Thickness | 0.076mm - 6.00mm | 0.076mm - 0.100mm |
| Minimum Line Width | 0.10mm | 0.075mm |
| Minimum Spacing | 0.10mm | 0.075mm |
| Outer Copper Thickness | 8.75um - 175um | 8.75um - 280um |
| Inner Layer Copper Thickness | 17.5um - 175um | 0.15mm - 0.25mm |
| Drilling Hole Diameter (Mechanical Drill) | 0.25mm - 6.00mm | 0.15mm - 0.25mm |
| Hole Diameter (Mechanical Drill) | 0.20mm - 6.00mm | 0.10mm - 0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm / 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate Thickness to Aperture Ratio | 10:1 | 12:1 |
| Solder Mask Type | Photosensitive: green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug Hole Diameter | 0.25mm - 0.60mm | 0.60mm - 0.80mm |
| Impedance Tolerance | ±10% | ±5% |
| Surface Treatment Type | Hot air leveling, chemical nickel-gold, immersion silver, electroplated nickel-gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
| SMT Main Equipment Process Capability | ||
|---|---|---|
| Machine | Scope | Process Parameters |
| Printing Press GKG GLS | PCB Printing Seal | 50×50mm ~ 610×510mm |
| Printing Accuracy | ±0.018mm | |
| Frame Size | 420×520mm ~ 737×737mm | |
| PCB Thickness Range | 0.4-6mm | |
| All-in-one Machine for Stacking Board | PCB Conveying Seal | 50×50mm ~ 400×360mm |
| Unwinding Machine | PCB Conveying Seal | 50×50mm ~ 400×360mm |
| YAMAHA YSM20R | When Transferring 1 Board | L50×W50mm ~ L810×W490mm |
| SMD Theoretical Speed | 95,000 CPH (0.027 sec / CHIP) | |
| Mounting Range | 0201(mm) - 45×45mm, Component Mounting Height: <15mm | |
| Mounting Accuracy | CHIP ±0.035mm (±0.025mm), Cpk ≥1.0 (3σ) | |
| Number of Components | 140 Kinds (8mm Reel) | |
| YAMAHA YS24 | When Transferring 1 Board | L50×W50mm ~ L700×W460mm |
| SMD Theoretical Speed | 72,000 CPH (0.05 sec / CHIP) | |
| Mounting Range | 0201(mm) - 32×mm, Component Mounting Height: 6.5mm | |
| Mounting Accuracy | ±0.05mm (μ+3σ), ±0.03mm (3σ) | |
| Number of Components | 120 Kinds (8mm Reel) | |
| YAMAHA YSM10 | When Transferring 1 Board | L50×W50mm ~ L510×W460mm |
| SMD Theoretical Speed | 46,000 CPH (0.078 sec / CHIP) | |
| Mounting Range | 0201(mm) - 45×mm, Component Mounting Height: 15mm | |
| Mounting Accuracy | ±0.035mm (±0.025mm), Cpk ≥1.0 (3σ) | |
| Number of Components | 48 Types (8mm Reel) / 15 Automatic IC Trays | |
| JT TEA-1000 | Adjustable for Each Dual Track | W50~270mm Substrate / Single Track Adjustable W50×W450mm |
| Height of Components on PCB | 25mm Up and Down | |
| Conveyor Belt Speed | 300~2000 mm/min | |
| ALeader ALD7727D AOI Online | Resolution / Visual Range / Speed | Optional: 7µm/Pixel, FOV: 28.62×21mm, Standard: 15µm/Pixel, FOV: 61.44×45mm |
| Detection Speed | <230ms/FOV | |
| Barcode System | Automatic Barcode Recognition (1D or 2D) | |
| PCB Size Range | 50×50mm (Min) ~ 510×300mm (Max) | |
| 1 Track Fixed | 1 track fixed, 2~4 tracks adjustable, Min size 95mm, Max size 700mm | |
| Single Track | Max Width 550mm; Double Tracks Max Width 300mm | |
| PCB Thickness Range | 0.2~5mm | |
| PCB Top & Bottom Clearance | Top: 30mm, Bottom: 60mm | |
| SPI Stech | Barcode System | Automatic Barcode Recognition (1D or 2D) |
| PCB Size Range | 50×50mm (Min) ~ 630×590mm (Max) | |
| Precision | 1µm, Height: 0.37µm | |
| Repeatability | <1µm (4σ), Volume/Area <1% (4σ), Height >1µm (4σ) | |
| FOV Speed | 0.3s/FOV | |
| Reference Point Detection Time | 0.5 sec/pcs | |
| Maximum Detection Height | ±550µm ~ 1200µm | |
| Bending PCB Maximum Measurement Height | ±3.5mm ~ ±5mm | |
| Minimum Pad Pitch | 100µm (Pad Height 1500µm) | |
| Minimum Measurement Size | Rectangle 150µm, Round 200µm | |
| Component Height on PCB | 40mm Up and Down | |
| PCB Board Thickness | 0.4~7mm | |
| Shansi XRAY Inspection Equipment VX1800 | Light Tube Voltage | 130V-160KV |
| Light Tube Current | 0.15mA | |
| System Magnification | 130kV: 1500×, 160kV: 6000× | |
| Closed Tube Function | Optional 90KV & 130KV, High Power Penetration Shielding | |
| Detect Samples at 70° Angle | System Magnification up to 6000× | |
| Light Pipe Focus Size | 1~3µm | |
| Stage | 650×540mm | |
| Geometric Magnification | 300× | |
| BGA Detection | Clear image for BGA virtual soldering and tin cracks | |
| Stage Positioning | X, Y, Z direction; X-ray tube & detector positioning | |
KKPCB is a leading electronic solutions provider specializing in PCB design, fabrication, assembly, and testing for Flex, Rigid-Flex, RF/Microwave, HDI, rigid multilayer, and ATE test boards. We offer comprehensive end-to-end services, including prototyping, component sourcing, SMT/THT assembly, functional testing, enclosure assembly, and final product packaging. With our one-stop, in-house capabilities, KKPCB delivers OEM and ODM solutions with fast turnaround, high quality, and cost-effective results, serving clients worldwide.